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ENH: add protection for chamber temperature

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As title. Also add time for waiting chamber temp in printing time

Signed-off-by: xun.zhang <xun.zhang@bambulab.com>
Change-Id: I8054080d2e8821e421a6d03222b8b25365b5977f
This commit is contained in:
xun.zhang 2023-08-15 14:19:31 +08:00 • committed by Lane.Wei
parent 7a439c523f
commit 5e23f73866
6 changed files with 48 additions and 3 deletions
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10
src/libslic3r/GCode/GCodeProcessor.cpp
View file

@ -1793,6 +1793,7 @@ void GCodeProcessor::process_gcode_line(const GCodeReader::GCodeLine& line, bool
case '9':
switch (cmd[3]) {
case '0': { process_M190(line); break; } // Wait bed temperature
case '1': { process_M191(line); break; } // Wait chamber temperature
default: break;
}
default:
@ -3718,6 +3719,15 @@ void GCodeProcessor::process_M190(const GCodeReader::GCodeLine& line)
m_highest_bed_temp = m_highest_bed_temp < (int)new_temp ? (int)new_temp : m_highest_bed_temp;
}
void GCodeProcessor::process_M191(const GCodeReader::GCodeLine& line)
{
float chamber_temp = 0;
const float wait_chamber_temp_time = 720.0;
// BBS: when chamber_temp>40,caculate time required for heating
if (line.has_value('S', chamber_temp) && chamber_temp > 40)
simulate_st_synchronize(wait_chamber_temp_time);
}
void GCodeProcessor::process_M201(const GCodeReader::GCodeLine& line)
{

3
src/libslic3r/GCode/GCodeProcessor.hpp
View file

@ -827,6 +827,9 @@ namespace Slic3r {
//BBS: wait bed temperature
void process_M190(const GCodeReader::GCodeLine& line);
//BBS: wait chamber temperature
void process_M191(const GCodeReader::GCodeLine& line);
// Set max printing acceleration
void process_M201(const GCodeReader::GCodeLine& line);

4
src/libslic3r/PrintConfig.cpp
View file

@ -3183,7 +3183,9 @@ void PrintConfigDef::init_fff_params()
def = this->add("chamber_temperatures", coInts);
def->label = L("Chamber temperature");
def->tooltip = L("By opening chamber_temperature compensation, the heating components will operate to elevate the chamber temperature."
"This can help suppress or reduce warping for high-temperature materials and potentially lead to higher interlayer bonding strength");
"This can help suppress or reduce warping for high-temperature materials and potentially lead to higher interlayer bonding strength."
"While for PLA, PETG, TPU, PVA and other low temperature materials, the actual chamber temperature should not be high to avoid cloggings,"
"so extra chamber temperature compensation is not needed, and 0 is highly recommended");
def->sidetext = L("°C");
def->full_label = L("Chamber temperature during print.0 means do not open compensation.Don't open it for low-temperature filaments like PLA, PETG, TPU");
def->min = 0;